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Freescale Semiconductor Technical Data
MRF1535T1 Rev. 7, 3/2005
RF Power Field Effect Transistors
N-Channel Enhancement-Mode Lateral MOSFETs
Designed for broadband commercial and industrial applications with frequencies to 520 MHz. The high gain and broadband performance of these devices make them ideal for large-signal, common source amplifier applications in 12.5 volt mobile FM equipment. * Specified Performance @ 520 MHz, 12.5 Volts Output Power -- 35 Watts Power Gain -- 10.0 dB Efficiency -- 50% * Capable of Handling 20:1 VSWR, @ 15.6 Vdc, 520 MHz, 2 dB Overdrive * Excellent Thermal Stability * Characterized with Series Equivalent Large-Signal Impedance Parameters * Broadband-Full Power Across the Band: 135-175 MHz 400-470 MHz 450-520 MHz * Broadband UHF/VHF Demonstration Amplifier Information Available Upon Request * N Suffix Indicates Lead-Free Terminations * 200_C Capable Plastic Package * In Tape and Reel. T1 Suffix = 500 Units per 44 mm, 13 inch Reel.
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1
520 MHz, 35 W, 12.5 V LATERAL N-CHANNEL BROADBAND RF POWER MOSFETs
CASE 1264-09, STYLE 1 TO-272 PLASTIC MRF1535T1(NT1)
CASE 1264A-02, STYLE 1 TO-272 STRAIGHT LEAD PLASTIC MRF1535FT1(FNT1)
Table 1. Maximum Ratings
Rating Drain-Source Voltage Gate-Source Voltage Drain Current -- Continuous Total Device Dissipation @ TC = 25C Derate above 25C Storage Temperature Range Operating Junction Temperature
(1)
Symbol VDSS VGS ID PD Tstg TJ
Value -0.5, +40 20 6 135 0.50 -65 to +150 200
Unit Vdc Vdc Adc W W/C C C
Table 2. Thermal Characteristics
Characteristic Thermal Resistance, Junction to Case Symbol RJC Value 0.90 Unit C/W
Table 3. Moisture Sensitivity Level
Test Methodology Per JESD 22-A113, IPC/JEDEC J-STD-020 TJ - TC 1. Calculated based on the formula PD = RJC NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed. Rating 1 Package Peak Temperature 260 Unit C
(c) Freescale Semiconductor, Inc., 2005. All rights reserved.
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 1
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RF Device Data Freescale Semiconductor
Table 4. Electrical Characteristics (TC = 25C unless otherwise noted)
Characteristic Off Characteristics Drain-Source Breakdown Voltage (VGS = 0 Vdc, ID = 100 Adc) Zero Gate Voltage Drain Current (VDS = 60 Vdc, VGS = 0 Vdc) Gate-Source Leakage Current (VGS = 10 Vdc, VDS = 0 Vdc) On Characteristics Gate Threshold Voltage (VDS = 12.5 Vdc, ID = 400 A) Drain-Source On-Voltage (VGS = 5 Vdc, ID = 0.6 A) Drain-Source On-Voltage (VGS = 10 Vdc, ID = 2.0 Adc) Dynamic Characteristics Input Capacitance (Includes Input Matching Capacitance) (VDS = 12.5 Vdc, VGS = 0 V, f = 1 MHz) Output Capacitance (VDS = 12.5 Vdc, VGS = 0 V, f = 1 MHz) Reverse Transfer Capacitance (VDS = 12.5 Vdc, VGS = 0 V, f = 1 MHz) RF Characteristics (In Freescale Test Fixture) Common-Source Amplifier Power Gain (VDD = 12.5 Vdc, Pout = 35 Watts, IDQ = 500 mA) Drain Efficiency (VDD = 12.5 Vdc, Pout = 35 Watts, IDQ = 500 mA) f = 520 MHz f = 520 MHz Gps dB 10 50 -- -- -- % -- No Degradation in Output Power Before and After Test Ciss Coss Crss -- -- -- -- -- -- 250 150 20 pF pF pF VGS(th) RDS(on) VDS(on) 1 -- -- -- -- -- 2.6 0.7 1 Vdc Vdc V(BR)DSS IDSS IGSS 60 -- -- -- -- -- -- 1 0.3 Vdc Adc Adc Symbol Min Typ Max Unit
Load Mismatch (VDD = 15.6 Vdc, f = 520 MHz, 2 dB Input Overdrive, VSWR 20:1 at All Phase Angles)
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 2 RF Device Data Freescale Semiconductor
VGG C11
+
C10
R4
R3
C23 L5 C9
B1
C22
+ C21
VDD
RF INPUT N1 C1
R2 R1 Z1 C2 C3 L1 C4 Z2 Z3 C5 L2 C6 C7 Z4 Z5 DUT
Z6 C12
Z7 C13 C14
Z8 C15
Z9 C16
L3 C17
L4 C18
Z10
RF OUTPUT N2 C20 C19
C8
B1 C1, C9, C20, C23 C2, C5 C3, C15 C4, C6, C19 C7 C8 C10, C21 C11, C22 C12, C13 C14 C16 C17 C18 L1 L2 L3
Ferroxcube #VK200 330 pF, 100 mil Chip Capacitors 0 to 20 pF Trimmer Capacitors 33 pF, 100 mil Chip Capacitors 18 pF, 100 mil Chip Capacitors 160 pF, 100 mil Chip Capacitor 240 pF, 100 mil Chip Capacitor 10 F, 50 V Electrolytic Capacitors 470 pF, 100 mil Chip Capacitors 150 pF, 100 mil Chip Capacitors 110 pF, 100 mil Chip Capacitor 68 pF, 100 mil Chip Capacitor 120 pF, 100 mil Chip Capacitor 51 pF, 100 mil Chip Capacitor 17.5 nH, Coilcraft #A05T 5 nH, Coilcraft #A02T 1 Turn, #26 AWG, 0.250 ID
L4 L5 N1, N2 R1 R2 R3 R4 Z1 Z2 Z3 Z4 Z5, Z6 Z7 Z8 Z9 Z10 Board
1 Turn, #26 AWG, 0.240 ID 4 Turn, #24 AWG, 0.180 ID Type N Flange Mounts 6.5 , 1/4 W Chip Resistor 39 Chip Resistor (0805) 1.2 k, 1/8 W Chip Resistor 33 k, 1/4 W Chip Resistor 0.970 x 0.080 Microstrip 0.380 x 0.080 Microstrip 0.190 x 0.080 Microstrip 0.160 x 0.080 Microstrip 0.110 x 0.200 Microstrip 0.490 x 0.080 Microstrip 0.250 x 0.080 Microstrip 0.320 x 0.080 Microstrip 0.240 x 0.080 Microstrip Glass Teflon(R), 31 mils
Figure 1. 135 - 175 MHz Broadband Test Circuit
TYPICAL CHARACTERISTICS, 135 - 175 MHz
60 Pout , OUTPUT POWER (WATTS) IRL, INPUT RETURN LOSS (dB) 50 40 30 20 10 VDD = 12.5 Vdc 0 0 1 2 3 4 -20 10 20 30 40 155 MHz 135 MHz 175 MHz 0
-5
-10
155 MHz 135 MHz 175 MHz
-15 VDD = 12.5 Vdc 50 60
Pin, INPUT POWER (WATTS)
Pout, OUTPUT POWER (WATTS)
Figure 2. Output Power versus Input Power
Figure 3. Input Return Loss versus Output Power
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 RF Device Data Freescale Semiconductor 3
TYPICAL CHARACTERISTICS, 135 - 175 MHz
19 18 17 GAIN (dB) 16 15 14 13 12 11 10 20 30 155 MHz 175 MHz 40 135 MHz 50 60 VDD = 12.5 Vdc h, DRAIN EFFICIENCY (%) 80 155 MHz 70 60 50 40 VDD = 12.5 Vdc 30 10 20 30 40 50 60 70 80
175 MHz
135 MHz
Pout, OUTPUT POWER (WATTS)
Pout, OUTPUT POWER (WATTS)
Figure 4. Gain versus Output Power
Figure 5. Drain Efficiency versus Output Power
50 Pout , OUTPUT POWER (WATTS)
80 155 MHz 175 MHz 60 135 MHz
155 MHz 175 MHz 135 MHz
40
35 VDD = 12.5 Vdc Pin = 30 dBm 30 200 400 600 800 1000 1200
h, DRAIN EFFICIENCY (%)
45
70
50 VDD = 12.5 Vdc Pin = 30 dBm 200 400 600 800 1000 1200
40
IDQ, BIASING CURRENT (mA)
IDQ, BIASING CURRENT (mA)
Figure 6. Output Power versus Biasing Current
Figure 7. Drain Efficiency versus Biasing Current
70 Pout , OUTPUT POWER (WATTS) 60 50 40 30 20 10 175 MHz 155 MHz 135 MHz h, DRAIN EFFICIENCY (%)
80 135 MHz 175 MHz 60 155 MHz
70
50 IDQ = 250 mA Pin = 30 dBm 10 11 12 13 14 15
IDQ = 250 mA Pin = 30 dBm 10 11 12 13 14 15
40
VDD, SUPPLY VOLTAGE (VOLTS)
VDD, SUPPLY VOLTAGE (VOLTS)
Figure 8. Output Power versus Supply Voltage
Figure 9. Drain Efficiency versus Supply Voltage
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 4 RF Device Data Freescale Semiconductor
VGG C14 C13 C12 + C11 R3 R2 R1 RF INPUT N1 C1 Z1 C2 C3 Z2 C4 Z3 C5 Z4 C6 C7 C10 DUT Z5 C8 Z6 C9 Z7 C15 C16 Z8 C17 C25
B1 VDD L1 C24 C23 + C22
Z9 C18
C19 C20
Z10 C21
N2
RF OUTPUT
B1 C1 C2 C3 C4 C5 C6, C7 C8, C15, C16 C9 C10, C14, C25 C11, C22 C12, C24 C13, C23 C17, C18 C19 C20
Ferroxcube VK200 160 pF, 100 mil Chip Capacitor 3 pF, 100 mil Chip Capacitor 3.6 pF, 100 mil Chip Capacitor 2.2 pF, 100 mil Chip Capacitor 10 pF, 100 mil Chip Capacitor 16 pF, 100 mil Chip Capacitors 27 pF, 100 mil Chip Capacitors 43 pF, 100 mil Chip Capacitor 160 pF, 100 mil Chip Capacitors 10 F, 50 V Electrolytic Capacitors 1,200 pF, 100 mil Chip Capacitors 0.1 F, 100 mil Chip Capacitors 24 pF, 100 mil Chip Capacitors 160 pF, 100 mil Chip Capacitor 8.2 pF, 100 mil Chip Capacitor
C21 L1 N1, N2 R1 R2 R3 Z1 Z2 Z3 Z4 Z5, Z8 Z6, Z7 Z9 Z10 Board
1.8 pF, 100 mil Chip Capacitor 47.5 nH, 5 Turn, Coilcraft Type N Flange Mounts 500 Chip Resistor (0805) 1 k Chip Resistor (0805) 33 k, 1/8 W Chip Resistor 0.480 x 0.080 Microstrip 1.070 x 0.080 Microstrip 0.290 x 0.080 Microstrip 0.160 x 0.080 Microstrip 0.120 x 0.080 Microstrip 0.120 x 0.223 Microstrip 1.380 x 0.080 Microstrip 0.625 x 0.080 Microstrip Glass Teflon(R), 31 mils
Figure 10. 450 - 520 MHz Broadband Test Circuit
TYPICAL CHARACTERISTICS, 450 - 520 MHz
60 Pout , OUTPUT POWER (WATTS) 50 40 30 20 10 0 VDD = 12.5 Vdc 0 1 2 3 4 5 6 -15 0 10 20 30 450 MHz 500 MHz 470 MHz 520 MHz IRL, INPUT RETURN LOSS (dB) 0 VDD = 12.5 Vdc -5 450 MHz -10 470 MHz 520 MHz 500 MHz 40 50 60
Pin, INPUT POWER (WATTS)
Pout, OUTPUT POWER (WATTS)
Figure 11. Output Power versus Input Power
Figure 12. Input Return Loss versus Output Power
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 RF Device Data Freescale Semiconductor 5
TYPICAL CHARACTERISTICS, 450 - 520 MHz
15 470 MHz 14 h, DRAIN EFFICIENCY (%) 13 GAIN (dB) 12 11 10 9 520 MHz 0 10 20 30 40 500 MHz 50 60 20 0 10 20 30 40 VDD = 12.5 Vdc 60 50 40 30 VDD = 12.5 Vdc 50 60 470 MHz 70 520 MHz 500 MHz 450 MHz
450 MHz
Pout, OUTPUT POWER (WATTS)
Pout, OUTPUT POWER (WATTS)
Figure 13. Gain versus Output Power
Figure 14. Drain Efficiency versus Output Power
50 Pout , OUTPUT POWER (WATTS) 450 MHz 470 MHz 500 MHz 40 520 MHz 35 VDD = 12.5 Vdc Pin = 34 dBm 30 200 400 600 800 1000 1200 h, DRAIN EFFICIENCY (%) 45
80
70 520 MHz 60 450 MHz 500 MHz
470 MHz
50 VDD = 12.5 Vdc Pin = 34 dBm 40 200 400 600 800 1000 1200
IDQ, BIASING CURRENT (mA)
IDQ, BIASING CURRENT (mA)
Figure 15. Output Power versus Biasing Current
Figure 16. Drain Efficiency versus Biasing Current
70 Pout , OUTPUT POWER (WATTS) 60 h, DRAIN EFFICIENCY (%)
80
70 520 MHz 60 450 MHz 470 MHz 50 500 MHz
50 40 30 20 10 450 MHz 500 MHz 470 MHz IDQ = 250 mA Pin = 34 dBm 10 11 12 13 14 15
520 MHz
40
IDQ = 250 mA Pin = 34 dBm 10 11 12 13 14 15
VDD, SUPPLY VOLTAGE (VOLTS)
VDD, SUPPLY VOLTAGE (VOLTS)
Figure 17. Output Power versus Supply Voltage
Figure 18. Drain Efficiency versus Supply Voltage
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 6 RF Device Data Freescale Semiconductor
Zo = 10 Zin ZOL* f = 175 MHz f = 135 MHz ZOL* f = 520 MHz f = 450 MHz f = 520 MHz Zin f = 175 MHz f = 135 MHz
f = 450 MHz
VDD = 12.5 V, IDQ = 250 mA, Pout = 35 W f MHz 135 155 175 Zin 5.0 + j0.9 5.0 + j0.9 3.0 + j1.0 ZOL* 1.7 + j0.2 1.7 + j0.2 1.3 + j0.1
VDD = 12.5 V, IDQ = 500 mA, Pout = 35 W f MHz 450 470 500 520 Zin 0.8 - j1.4 0.9 - j1.4 1.0 - j1.4 0.9 - j1.4 ZOL* 1.0 - j0.8 1.1 - j0.6 1.1 - j0.6 1.1 - j0.5
Zin
= Complex conjugate of source impedance.
Zin
= Complex conjugate of source impedance.
ZOL* = Complex conjugate of the load impedance at given output power, voltage, frequency, and D > 50 %.
ZOL* = Complex conjugate of the load impedance at given output power, voltage, frequency, and D > 50 %.
Note: ZOL* was chosen based on tradeoffs between gain, drain efficiency, and device stability.
Input Matching Network
Device Under Test
Output Matching Network
Z
in
Z
* OL
Figure 19. Series Equivalent Input and Output Impedance
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 RF Device Data Freescale Semiconductor 7
Table 5. Common Source Scattering Parameters (VDD = 12.5 Vdc) IDQ = 250 mA
f MHz 50 100 150 200 250 300 350 400 450 500 550 600 S11 |S11| 0.89 0.90 0.91 0.92 0.94 0.95 0.96 0.96 0.97 0.97 0.98 0.98 -173 -175 -175 -175 -176 -176 -176 -176 -176 -176 -176 -177 |S21| 8.496 3.936 2.429 1.627 1.186 0.888 0.686 0.568 0.457 0.394 0.332 0.286 S21 83 72 63 57 53 49 48 44 44 44 42 41 |S12| 0.014 0.014 0.011 0.010 0.007 0.005 0.005 0.005 0.004 0.003 0.001 0.013 S12 -26 -14 -23 -44 -16 -44 36 -1 49 -51 31 99 |S22| 0.76 0.79 0.82 0.86 0.88 0.91 0.92 0.94 0.94 0.95 0.95 0.94 S22 -170 -170 -170 -170 -170 -171 -170 -171 -172 -171 -173 -173
IDQ = 1.0 A
f MHz 50 100 150 200 250 300 350 400 450 500 550 600 S11 |S11| 0.90 0.90 0.91 0.92 0.94 0.95 0.96 0.96 0.97 0.97 0.98 0.98 -173 -175 -175 -175 -176 -176 -176 -176 -176 -176 -176 -177 |S21| 8.49 3.92 2.44 1.62 1.19 0.89 0.69 0.57 0.46 0.39 0.33 0.28 S21 83 72 63 57 53 48 48 44 44 44 41 41 |S12| 0.006 0.009 0.006 0.008 0.006 0.008 0.007 0.004 0.004 0.003 0.006 0.009 S12 -39 -5 7 21 8 3 48 41 43 57 62 96 |S22| 0.86 0.86 0.87 0.88 0.89 0.89 0.91 0.93 0.93 0.94 0.94 0.93 S22 -176 -176 -176 -175 -174 -174 -174 -173 -173 -173 -174 -173
IDQ = 2.0 A
f MHz 50 100 150 200 250 300 350 400 450 500 550 600 S11 |S11| 0.94 0.94 0.94 0.94 0.95 0.95 0.95 0.96 0.96 0.96 0.97 0.97 -176 -178 -178 -178 -178 -178 -178 -178 -178 -177 -177 -178 |S21| 9.42 4.56 2.99 2.14 1.67 1.32 1.08 0.93 0.78 0.68 0.59 0.51 S21 88 82 78 74 71 67 67 63 62 61 58 57 |S12| 0.005 0.005 0.003 0.005 0.004 0.007 0.005 0.003 0.007 0.004 0.008 0.009 S12 -72 4 7 17 40 35 57 50 68 99 78 92 |S22| 0.89 0.89 0.89 0.90 0.90 0.91 0.92 0.93 0.93 0.94 0.93 0.92 S22 -177 -177 -177 -176 -175 -175 -174 -173 -173 -173 -175 -174
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 8 RF Device Data Freescale Semiconductor
APPLICATIONS INFORMATION
DESIGN CONSIDERATIONS This device is a common-source, RF power, N-Channel enhancement mode, Lateral Metal-Oxide Semiconductor Field-Effect Transistor (MOSFET). Freescale Application Note AN211A, "FETs in Theory and Practice", is suggested reading for those not familiar with the construction and characteristics of FETs. This surface mount packaged device was designed primarily for VHF and UHF mobile power amplifier applications. Manufacturability is improved by utilizing the tape and reel capability for fully automated pick and placement of parts. However, care should be taken in the design process to insure proper heat sinking of the device. The major advantages of Lateral RF power MOSFETs include high gain, simple bias systems, relative immunity from thermal runaway, and the ability to withstand severely mismatched loads without suffering damage. MOSFET CAPACITANCES The physical structure of a MOSFET results in capacitors between all three terminals. The metal oxide gate structure determines the capacitors from gate-to-drain (Cgd), and gate-to-source (Cgs). The PN junction formed during fabrication of the RF MOSFET results in a junction capacitance from drain-to-source (Cds). These capacitances are characterized as input (Ciss), output (Coss) and reverse transfer (Crss) capacitances on data sheets. The relationships between the inter-terminal capacitances and those given on data sheets are shown below. The Ciss can be specified in two ways: 1. Drain shorted to source and positive voltage at the gate. 2. Positive voltage of the drain in respect to source and zero volts at the gate. In the latter case, the numbers are lower. However, neither method represents the actual operating conditions in RF applications. drain-source voltage under these conditions is termed VDS(on). For MOSFETs, VDS(on) has a positive temperature coefficient at high temperatures because it contributes to the power dissipation within the device. BVDSS values for this device are higher than normally required for typical applications. Measurement of BVDSS is not recommended and may result in possible damage to the device. GATE CHARACTERISTICS The gate of the RF MOSFET is a polysilicon material, and is electrically isolated from the source by a layer of oxide. The DC input resistance is very high - on the order of 109 -- resulting in a leakage current of a few nanoamperes. Gate control is achieved by applying a positive voltage to the gate greater than the gate-to-source threshold voltage, VGS(th). Gate Voltage Rating -- Never exceed the gate voltage rating. Exceeding the rated VGS can result in permanent damage to the oxide layer in the gate region. Gate Termination -- The gates of these devices are essentially capacitors. Circuits that leave the gate open-circuited or floating should be avoided. These conditions can result in turn-on of the devices due to voltage build-up on the input capacitor due to leakage currents or pickup. Gate Protection -- These devices do not have an internal monolithic zener diode from gate-to-source. If gate protection is required, an external zener diode is recommended. Using a resistor to keep the gate-to-source impedance low also helps dampen transients and serves another important function. Voltage transients on the drain can be coupled to the gate through the parasitic gate-drain capacitance. If the gate-to-source impedance and the rate of voltage change on the drain are both high, then the signal coupled to the gate may be large enough to exceed the gate-threshold voltage and turn the device on. DC BIAS Since this device is an enhancement mode FET, drain current flows only when the gate is at a higher potential than the source. RF power FETs operate optimally with a quiescent drain current (IDQ), whose value is application dependent. This device was characterized at IDQ = 150 mA, which is the suggested value of bias current for typical applications. For special applications such as linear amplification, IDQ may have to be selected to optimize the critical parameters. The gate is a dc open circuit and draws no current. Therefore, the gate bias circuit may generally be just a simple resistive divider network. Some special applications may require a more elaborate bias system. GAIN CONTROL Power output of this device may be controlled to some degree with a low power dc control signal applied to the gate, thus facilitating applications such as manual gain control, ALC/AGC and modulation systems. This characteristic is very dependent on frequency and load line.
Drain Cgd Gate Ciss = Cgd + Cgs Coss = Cgd + Cds Crss = Cgd
Cds Cgs Source
DRAIN CHARACTERISTICS One critical figure of merit for a FET is its static resistance in the full-on condition. This on-resistance, RDS(on), occurs in the linear region of the output characteristic and is specified at a specific gate-source voltage and drain current. The
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 RF Device Data Freescale Semiconductor 9
MOUNTING The specified maximum thermal resistance of 0.9C/W assumes a majority of the 0.170 x 0.608 source contact on the back side of the package is in good contact with an appropriate heat sink. As with all RF power devices, the goal of the thermal design should be to minimize the temperature at the back side of the package. Refer to Freescale Application Note AN4005/D, "Thermal Management and Mounting Method for the PLD-1.5 RF Power Surface Mount Package," and Engineering Bulletin EB209/D, "Mounting Method for RF Power Leadless Surface Mount Transistor" for additional information. AMPLIFIER DESIGN Impedance matching networks similar to those used with bipolar transistors are suitable for this device. For examples see Freescale Application Note AN721, "Impedance Matching Networks Applied to RF Power Transistors."
Large-signal impedances are provided, and will yield a good first pass approximation. Since RF power MOSFETs are triode devices, they are not unilateral. This coupled with the very high gain of this device yields a device capable of self oscillation. Stability may be achieved by techniques such as drain loading, input shunt resistive loading, or output to input feedback. The RF test fixture implements a parallel resistor and capacitor in series with the gate, and has a load line selected for a higher efficiency, lower gain, and more stable operating region. Two-port stability analysis with this device's S-parameters provides a useful tool for selection of loading or feedback circuitry to assure stable operation. See Freescale Application Note AN215A, "RF Small-Signal Design Using Two-Port Parameters" for a discussion of two port network theory and stability.
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 10 RF Device Data Freescale Semiconductor
NOTES
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 RF Device Data Freescale Semiconductor 11
NOTES
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 12 RF Device Data Freescale Semiconductor
NOTES
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 RF Device Data Freescale Semiconductor 13
PACKAGE DIMENSIONS
A
B r1
E1
DRAIN ID NOTE 6
4X
b2 aaa
M
4 DA
6 1
DRAIN ID
D1 aaa
M
DA
2X
5 b1
M
5 DA
aaa
2
D
4X
e
4
6
4X
3
b3
E C
SEATING PLANE
A
DATUM PLANE
H Y
E2 Y D
SEATING PLANE
NOTES: 1. CONTROLLING DIMENSION: INCH . 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DATUM PLANE -H- IS LOCATED AT TOP OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE TOP OF THE PARTING LINE. 4. DIMENSION D AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.006 PER SIDE. DIMENSION D AND E1 DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 5. DIMENSIONS b1 AND b3 DO NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.005 TOTAL IN EXCESS OF THE b1 AND b2 DIMENSIONS AT MAXIMUM MATERIAL CONDITION. 6. CROSSHATCHING REPRESENTS THE EXPOSED AREA OF THE HEAT SLUG. DIM A A1 A2 D D1 E E1 E2 L b1 b2 b3 c1 e r1 q aaa INCHES MIN MAX 0.098 0.108 0.000 0.004 0.100 0.104 0.928 0.932 0.806 0.814 0.296 0.304 0.248 0.252 0.241 0.245 0.060 0.070 0.193 0.199 0.078 0.084 0.088 0.094 0.007 0.011 0.193 BSC 0.063 0.068 0_ 6_ 0.004 MILLIMETERS MIN MAX 2.49 2.74 0.00 0.10 2.54 2.64 23.57 23.67 20.47 20.68 7.52 7.72 6.30 6.40 6.12 6.22 1.52 1.78 4.90 5.05 1.98 2.13 2.24 2.39 0.18 0.28 4.90 BSC 1.60 1.73 0_ 6_ 0.10
L q
A1
A2
STYLE 1: PIN 1. 2. 3. 4. 5. 6. SOURCE (COMMON) DRAIN SOURCE (COMMON) SOURCE (COMMON) GATE SOURCE (COMMON)
c1
CASE 1264-09 ISSUE J TO-272 PLASTIC MRF1535T1(NT1)
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 14 RF Device Data Freescale Semiconductor
CCCC CCCC CCCC CCCC CCCC CCCC CCCC CCCC CCCC CCCC CCCC CCCC CCCC
E2 VIEW Y-Y
3
2
1
2X
P DAB
B
E1
A
E2
aaa
M
DRAIN ID NOTE 5
4X
b2 aaa
M
DA
4
1
DRAIN ID
6
2X
b1
M
aaa
DA
5
2
D
4X
D2
5
e
6
4X
3
4
D1 aaa
M
b3 DA
E
c1 A D
SEATING PLANE
Y
ZONE "J"
F
Y
A1 6 A2
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.006 PER SIDE. DIMENSIONS D AND E1 DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 4. DIMENSIONS b1 AND b3 DO NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.005 TOTAL IN EXCESS OF THE b1 AND b2 DIMENSIONS AT MAXIMUM MATERIAL CONDITION. 5. CROSSHATCHING REPRESENTS THE EXPOSED AREA OF THE HEAT SLUG. 6. DIMENSION A2 APPLIES WITHIN ZONE J ONLY. DIM A A1 A2 D D1 D2 E E1 E2 F P b1 b2 b3 c1 e aaa bbb INCHES MIN MAX 0.098 0.106 0.038 0.044 0.040 0.042 0.926 0.934 0.810 BSC 0.608 BSC 0.492 0.500 0.246 0.254 0.170 BSC 0.025 BSC 0.126 0.134 0.193 0.199 0.078 0.084 0.088 0.094 0.007 0.011 0.193 BSC 0.004 0.008 MILLIMETERS MIN MAX 2.49 2.69 0.96 1.12 1.02 1.07 23.52 23.72 20.57 BSC 15.44 BSC 12.50 12.70 6.25 6.45 4.32 BSC 0.64 BSC 3.20 3.40 4.90 5.05 1.98 2.13 2.24 2.39 0.178 0.279 4.90 BSC 0.10 0.20
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
SOURCE (COMMON) DRAIN SOURCE (COMMON) SOURCE (COMMON) GATE SOURCE (COMMON)
CASE 1264A-02 ISSUE A TO-272 STRAIGHT LEAD PLASTIC MRF1535FT1(FNT1)
MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1 RF Device Data Freescale Semiconductor 15
CCCC CCCC CCCC CCCC CCCC CCCC CCCC CCCC CCCC CCCC CCCC CCCC CCCC
VIEW Y-Y
3
2
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MRF1535NT1 MRF1535FNT1 MRF1535T1 MRF1535FT1
Document Number: MRF1535T1 Rev. 7, 3/2005
16
RF Device Data Freescale Semiconductor

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